GLOBALFOUNDRIES Launches the Industry’s First 22nm FD-SOI Technology Platform

On Monday, July 13, GLOBALFOUNDRIES launched a new semiconductor technology specifically aimed at meeting the increasing ultra-low-power requirements of the next generation of connected devices. The 22FDX platform can provide a multi-node, low-cost roadmap for wearable, consumer, multimedia, automotive, and other applications. The company and our partners celebrated the announcement with a week of events, which culminated in GLOBALFOUNDRIES’ participation in SEMICON West in California.

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GLOBALFOUNDRIES held several events around the globe, including a press conference at Fab 1 in Dresden featuring CEO Sanjay Jha, press briefings in Greater China and Japan, and several speaking opportunities at SEMICON West in California.

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In partnership with SemiWiki, GLOBALFOUNDRIES launched FDXtreme Week to feature 22FDX technology and its benefit to the industry.

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During the SEMICON West keynote panel, imec’s Jo de Boeck moderated a very interesting and frank discussion with Qualcomm’s Mike Campell, ASE’s Calvin Cheung, Stanford’s Subhasish Mitra and GLOBALFOUNDRIES’ Gary Patton. The panelists all agreed that cooperation is necessary.

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Patton concluded, “Orders-of-magnitude improvement is possible though innovation.” Brain circuits, he suggested, are not high speed, lack an interconnecting bus structure, and are low-power and reconfigurable—perhaps suggesting a roadmap for future devices. “I see a lot of potential and hope for the future,” he added.

FDXtreme Week was exciting and action-packed! We look forward to working closely with our partners for the successful production of GLOBALFOUNDRIES’ 22FDX platform that will drive the next wave of the digital revolution. Check out our Storify recap of FDXtreme Week here.