GLOBALFOUNDRIES CEO Ajit Manocha spoke to a crowd of more than 200 high-ranking executives from the Japanese semiconductor industry last week at the Nikkei Electronics’ World Semiconductor Industry Summit 2013 in Tokyo. During Manocha’s presentation titled, “Reshaping the Foundry Industry: Welcome to Foundry 2.0,” he outlined the evolution and future of the foundry model, the technical and business drivers reshaping the landscape and what it will take for Japanese IDM companies to move forward. Manocha urged Japanese companies to embrace the fabless model and revise their perspective on previous paradigms.
GLOBALFOUNDRIES is committed to the idea that future success in the semiconductor industry is dependent on joint development at the technology definition level, early engagement at the architectural stage and leveraging a more integrated and cooperative ecosystem. The same theme was very present in Manocha’s speech as he emphasized that the idea that Japan’s resurgence into the semiconductor industry can be fueled collaborative device partnerships.
GLOBALFOUNDRIES recently demonstrated its commitment to collaboration at The Common Platform Technology Forum 2013, where we made a number of joint announcements with our partners. Among those collaborations include Rambus, Synopsys, Adapteva and Cyclos Semiconductor – all of which will mutually benefit GLOBALFOUNDRIES and our partners, but more importantly our customers.
You can watch Manocha’s full speech online on our YouTube channel. Important highlights include:
- The old foundry model will no longer work with due to a slower rate of change, and inflexible methods and systems which are now required to become flexible (23:33)
- Our vision for 2020 includes homogeneous alliances as well as heterogeneous alliances between foundries, the airline industry, banking industry, semiconductors and the biomedical field (24:53)
- GLOBALFOUNDRIES’ acceleration of growth, viewed as a timeline (31:36):
- From 2007 to 2012, we developed the 65-, 45-, 32- and 28nm designs
- From 2013 to 2017, we have plans to break into the 20-, 14-, 10- and finally the 7nm design