Tag Archives: GLOBALFOUNDRIES

GLOBALFOUNDRIES to Highlight Technology Innovation at DAC 2013

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GLOBALFOUNDRIES is ramping up for the Design Automation Conference (DAC) this summer! During the event, which runs from June 3-6 in Austin, Texas, GLOBALFOUNDRIES will be featuring the latest details on its mainstream and leading-edge technology solutions and roadmap.  

GLOBALFOUNDRIES will be located at booth #1314 at DAC 13 for the duration of the event. In addition to highlighting our new 14nm-XM FinFET technology that will deliver more than twice the energy efficiency of a 28nm-SLP technology-based design, we’ll be demonstrating several products, including:

  • 20nm/14XM solutions; 28nm design methodology (Analog and Digital)
  • 28nm Super Low Power (SLP) Technology with Gate First HKMG, the optimized solution for high performance mobile applications, fully enabled today with design kits and IP
  • GlobalShuttle, the Multi Project Wafer program for product prototyping, device characterization, IP validation and design enablement
  • RF CMOS and other value added solution process modules
  • DFM; analog and digital reference flows; process-specific applications

GLOBALFOUNDRIES will also host a series of one-hour private technical seminars daily, which  will touch on a variety of topics, from our collaborative work with ARM to produce smartphones on our 28nm-SLP HKMG process to parasitic challenges for FinFET designs and analog mixed signal flows and methodology for double patterning and FinFETs. Pre-registration will be required for these informative seminars.

In addition to the seminars, a number of presentations and theater presentations will be given throughout the week including:

Tuesday, June 4

  • Pavilion Panel, Dave McCann: Is This the Right Time to Create Standards for 2.5D/3D-IC Designs?
  • Synopsys Breakfast, Subi Kengeri and Kelvin Low: Ready for Deploying 14XM FinFETs in Your Next Mobile SoC Design Management Day, Bob Madge: Decision-Making for Complex ICs
  • Cadence IP Talks, Subi Kengeri: Enabling SoC level differentiation through advanced technology R&D

Wednesday, June 5

  • Mentor Panel, Richard Trihy, No Fear of FinFET
  • Pavilion Panel, Luigi Capodieci, Learn the Secrets of Design for Yield

For more information and to schedule meetings at the show, check out our DAC microsite.  

Bringing MEMS to the Mainstream: Latest Milestones and Future Trends

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By: Rakesh Kumar

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The MEMS market is set to explode: by 2017 the market is expected to be worth $12.2 billion, a 50 percent increase from 2011, according to IHS iSuppli. Driving this growth will be the continued usage of MEMs devices for consumer applications, such as smartphones, tablets, gaming consoles and cameras. Additionally, new products such as silicon timing devices, tunable capacitors for antennas, autofocus actuators and pico-projectors are also emerging as market drivers.

In 2011, GLOBALFOUNDRIES laid the basis for our work in MEMS technology by qualifying products for our established customers and creating new customer relationships for the manufacturing of their products. Check out our previous post to learn more about the development of our MEMS technology in 2011.

We took the opportunity to ramp up our MEMS products in 2012. We observed that some of the unique MEMS tools on the market still lacked a level of ruggedness or maturity. To resolve that issue, we worked with our tool supplier to make improvements and optimize MEMS technology for large volume manufacturing. In 2012, we were also able to provide our customers with products for final reliability qualifications with very high yields.

The majority of MEMS devices require some degree of customization and standardized platforms may not be possible for all kinds of devices. Therefore, our initial focus was to develop key module and integration capabilities that would allow us to provide some form of reproducible and reusable building blocks for various MEMS devices. Some examples of such building blocks include cavity SOI wafers, poly TSV for interconnects, and hermetic sealing for wafer level encpasulation . In addition to these building blocks, we are working with A*STAR Institute of Microelectronics in Singapore to develop some platform technologies for specific applications as part of their MEMS consortium.

We are currently working on new processes and products that are on schedule for manufacturing by the 3rd and 4th quarter of this year. Many integrated device manufacturers (IDMs) and fabless companies have started process development with GLOBALFOUNDRIES. It is one of our biggest achievements that we have not only satisfied our customers, but also attracted potential new customers because of our capabilities and success.

Looking ahead, MEMS companies can only be successful if they offer a full solution to the end customer from design to application development, firmware, software etc. In the past, IDMs fulfilled this role; however, fabless companies are now beginning to meet the integration requirements, either by themselves or in partnerships with companies. Thus, we will begin to see fabless companies posing a big challenge to IDMs. The challenge will be the ability to get suitable MEMS foundries that can provide development support, shorter time to market and can build the capacity required to meet the demands of the consumer market.

We see an important role for foundries to play in order for the market to meet that challenge. We’re capable of using our processes to enable new product development, provide a fast ramp to production and offer competitive costs of manufacturing. We envision taking the role of a single supplier to provide the complete manufacturing solution that will allow our customers to focus on product design, firmware, applications and system level support. We can achieve this by not only offering device fabrication services, but also extending it to complete back end solutions in partnership with OSAT houses. With the careful selection of products and partners, we can create a pipeline of products that can provide a stiff competition to IDMs.

Throughout 2013, our focus will be on ramping up the production of MEMS significantly for the qualified products. We also plan to simultaneously continue our efforts to qualify more customer products. We see a number of challenges and growth opportunities in MEMS development, including the recent wave of MEMS sensors in relation to consumer applications areas. However, with increasing awareness of MEMS sensors and actuators and decreasing costs of system/subsystems use of MEMS devices, the MEMS market will grow significantly for automotive, industrial, safety/security and healthcare applications. With continued progress in the field, we hope to see motion sensor adoption in systems, tools which can detect variations for maintenance, energy harvester and bio-MEMS. 2013 will be another exciting year for MEMs and we look forward to the ride.

Rakesh Kumar is senior director of the MEMS program at GLOBALFOUNDRIES. Based in Singapore, he has over 25 years of experience in semiconductor process technology development for CMOS, MEMS and Silicon based opto-electronics devices. 

This entry was originally posted on SemiMD.

This Week: GLOBALFOUNDRIES to Present at Several Industry-Focused Events

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This week will be very busy for GLOBALFOUNDRIES, as we’ll be attending and speaking at a handful of industry events. We’ve included all the important details below, including dates, sessions and more. We’re excited for the upcoming week and hope you’ll join us!

The Linley Group Mobile Conference

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On Wednesday, April 17th, GLOBALFOUNDRIES Executive Vice President Mike Noonen will present at The Linley Group Mobile Conference 2013. This two-day conference will feature technical presentations addressing design issues for mobile devices such as tablet computers, smartphones, navigation devices, media players and more. In addition to hearing an overview of the market and current technologies, attendees have the opportunity to attend talks and panel discussions covering a variety of topics.

Mike Noonen will be featured during session two, on mobile SoC design, which will be moderated by Scott Gardner, senior analyst at The Linley Group. Mike’s presentation, entitled “Lessons from Barcelona: The Future of Mobile Technology is Here,” will focus on the semiconductor industry’s progress in bringing FinFET technology to the mobile SoC market, as well as recent developments in FinFET technology by GLOBALFOUNDRIES and our partners.

GSA Silicon Summit

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On April 18th, Bruce Kleinman, GLOBALFOUNDRIES’ vice president of product marketing, will moderate a panel at the GSA Silicon Summit in Mountain View, CA. This event focuses on the business and technical factors which will yield revolutionary electronic devices in the future.

Bruce’s session, “Integration Challenges and Opportunities,” will cover the need for unifying silicon technologies and changing business models to advance the future of electronic devices. Panelists include Jim Aralis (Microsemi), Dr. Misha Burich (Altera), Dr. William Chen (ASE), Steve Longoria (Soitec) and Dr. Robert Rogenmoser (SuVolta). For more updates from this event, follow the Twitter hashtag #GSAsummit.

Electronic Design Process Symposium

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Finally, on Friday, April 19th, representatives from GLOBALFOUNDRIES will participate on a panel at the 2013 Electronic Design Process Symposium (EDPS). The EDPS, which is now in its 20th year, features the “free exchange of ideas” among top industry influencers in chips and systems. GLOBALFOUNDRIES’ Fellows, Srinivasa Banna and Luigi Capodieci, will speak at 1 p.m. about FinFET foundry design enablement challenges.

Follow our Twitter and Facebook pages for more information and updates on these events.

New York’s Nanotechnology Model: Building the Innovation Economy

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Today GLOBALFOUNDRIES kicked off an economic symposium, done in partnership with the National Academy of Sciences entitled, “New York’s Nanotechnology Model: Building the Innovation Economy.” Taking place at the Hudson Valley Community College in Troy, New York, the symposium is intended to highlight NY state and regional innovation initiatives and innovation clusters in leading high-technology sectors such as nanotechnology and semiconductors.

The National Academy of Sciences’ recent report, Rising to the Challenge: U.S. Innovation Policy for the Global Economy, has highlighted global case studies of innovation partnerships. The upstate NY region has been an exceptional demonstration of innovation partnerships between state government, industry and universities. Investments by GLOBALFOUNDRIES, SEMATECH, IBM, The College of Nanoscale Science and Engineering at SUNY Albany and the Rensselaer Polytechnic Institute have contributed to the success of the region.

GLOBALFOUNDRIES is dedicated to the promotion of innovation in NY and in the United States and this was highlighted in the keynote address that CEO Ajit Manocha just delivered at the symposium. According to Manocha, the economy requires innovative approaches to the public-private partnerships that support new advanced manufacturing operations and those operations must be part of the nation’s economic strategy.

Manocha spoke about Fab 8 and other business progress in upstate New York and he shared both his vision for the company and his greater vision on how our company can shape the local, regional, national and global economy. Innovative approaches to public-private partnerships are necessary to support new advanced manufacturing operations which must be part of the nation’s economic strategy.

Defining Investment

In his speech, Manocha discussed the basis for our investment in New York, beginning in 2009 with the construction of Fab 8. Since that point, the Fab has expanded to consist of approximately two million square feet of development and will be capable of delivering a total manufacturing capacity of approximately 60,000 wafers per month once fully ramped with tools and equipment. GLOBALFOUNDRIES has currently made 2,000 new direct jobs in NY and that number is expected to grow by another 1,000 employees by the end of 2014.

Success in New York

Manocha discussed the various high-tech successes including technological innovation, job creation and advanced manufacturing. New York State’s public investments have developed CNSE as a hub of innovation, which combined with GLOBALFOUNDRIES’ private investments in Fab 8, are prime examples of the intimate links between research, innovation and production.

Why Semiconductors Matter in the US

Finally, Manocha touched upon the importance of the semiconductor industry in the United States. Semiconductors are the backbone of today’s modern digital economy, powering everything from smart phones to laptops, and they make up the nation’ largest export. The advanced manufacturing of semiconductors represents a unique opportunity to help the U.S. drive innovation, improve productivity and remain competitive in the global economy.

GLOBALFOUNDRIES is thrilled to contribute to the success of New York’s technology industry, but we are also looking forward to the future and the ability to contribute to the U.S. economy on a greater scale. This symposium provides the opportunity to reflect on the success of our work in New York, as well as opportunities for future investment. 

What’s In A Name?

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By Subi Kengeri

Consumers continue to demand smaller, faster and more energy-efficient electronic devices, driving the semiconductor industry to accelerate development of commercially viable chips on more advanced nodes. However, these new nodes don’t just appear by magic. It takes a great deal of careful planning to develop and deliver a process technology platform that offers competitiveness, differentiation, and manufacturability. This is the job of my team at GlobalFoundries. It always has been difficult, but the transition to 20nm and beyond presents a host of new challenges, requiring a fundamentally new approach to technology architecture and definition.

Over the past few nodes, SoC designers have grown accustomed to a roughly 30% reduction in die cost from node to node. But 20nm is the first node on which foundries introduced true double-patterning lithography, which increases manufacturing costs, largely dependent on the target application. So there has to be something else to prompt customers to adopt this new node. For example, it is critical that a technology platform deliver SoC product value and designability, and has to be optimized for the customer’s target application. At 20nm, we really began looking at the product level value for customers, which we define in terms of the optimum combination of performance, power and cost (PPC), in addition to other customer care-abouts.

We took this to a whole new level with our recently launched 14nm-XM offering. Once we had optimized PPC for our 20nm planar SoC offering, we looked at what it means to incorporate 3D FinFETs on the next node. Going from planar to FinFET gives us a step jump in performance and power, but minimal benefit in die size because we chose to use the fully optimzed middle and backend of line from 20nm-LPM. The key was to architect 14nm-XM to ensure the performance and power advantages outweigh the lack of area improvement and to ease designability on the first generation FinFET offering. Leveraging the 20nm-LPM competitive density advantages and using the most optimal 3D fin structure, we expect to get back on the historical 60% to 70% SoC PPC improvement trajectory. We also expect to see a big benefit in time-to-volume (on a node to node basis) because we will leverage key technology modules and PDKs from 20nm-LPM, which we believe will allow our customers to design concurrently and accelerate our FinFET high volume ramp by about one year.

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But one question I often get asked is, ‘Why do we call it a 14nm technology if it relies so much on 20nm?’ First of all, we are using a true 14nm-class FinFET as the front-end device, which qualifies it as a 14nm technology. But in reality the naming of nodes has become somewhat arbitrary over the past several nodes. A node used to be named based on the smallest transistor feature size, which was typically the channel length. But channel length scaling stopped at about 45nm, so the industry does not actually have a 28nm gate in a 28nm technology. Secondly, the point of moving to a new node is the delivery of value to the customer. They need to see a SoC level product value, which really translates to the PPC, and 14nm-XM offers a full node value. As long as customers see at least this level of value, they frankly don’t care what the technology is called or what is inside.

Now we need to find a way to deliver this same product level value at 10nm. The whole industry has quite a few challenges going to 10nm. FinFETs are scalable and will have a long life, but we will have already realized the performance and power value from the front-end device with 14nm-XM. We don’t expect extreme ultraviolet (EUV) lithography will be ready, at least not at the beginning of the node, which means we will have more layers that require multiple patterning and therefore significant cost increases. We will need to find other ways to provide performance and power benefits to deliver a total PPC to stay on the SoC value trajectory. We have been working on this and 7nm technologies for several years and we are very close to nailing down a competitive 10nm technology architecture. We are running 10nm devices in silicon and I am confident we will deliver the value our customers have come to expect.

For more detail on this topic, check out the recent interview with SemiMD’s Mark LaPedus, where we talk about FinFETs, EUV, and Moore’s Law.

Subramani “Subi” Kengeri is vice president of advanced technology architecture at GLOBALFOUNDRIES.

This post also appeared on Chip Design Magazine

GLOBALFOUNDRIES to Highlight 20/14nm Extractions and FinFET Technology at 2013 Synopsys User Group Conference

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Next week GLOBALFOUNDRIES will be attending and presenting at the 2013 Synopsys User Group (SNUG) Conference in Santa Clara, CA on March 25 to 27. Attendees will receive practical information on a variety of topics useful for jumpstarting future design or advancing innovation projects. We are looking forward to sharing our perspective on the industry, as well as technological advances with our partners and other members of the manufacturing community.

During the conference, GLOBALFOUNDRIES’ Design Methodology team will present their findings and flow recommendations on the 14 and 20nm extractions/STA on Monday, March 25 at 3:45 p.m. During this session, attendees will get a firsthand look at what exactly is required to perform 14nm and 20nm double patterning-aware extraction and static timing analysis. We have collaborated with Synopsys on validating the capabilities of the StarRC and PrimeTime-SI for those advanced nodes.

In addition to our Design Team presentation, GLOBALFOUNDRIES’ Vice President of Advanced Technology Architecture, Subramani Kengeri, will participate in a FinFET technology panel on Tuesday, March 26 at 10:30 a.m.. Kengeri will join other leading developers of FinFET technology and early adopters of FinFET-based design flow to discuss the future of the technology and the challenges they face. Panelists will highlight the evolution of transistors from microns to nanometers, as well as the future evolution into three dimensions. FinFET devices have the potential to deliver both power and performance characteristics necessary for today’s mobile computing market. The panel also will touch on challenges in developing the process and design flow for FinFETs and the importance of maintaining ecosystem partnerships.

In addition to these activities, GLOBALFOUNDRIES representatives will be available on the exhibit show floor on March 25 from 4 to 8 p.m. during the SNUG Designer Community Expo. This is a great time to learn more about GLOBALFOUNDRIES, including our design, products and partner collaboration projects. We look forward to seeing you there! 

Reshaping the Foundry Industry: Welcome to Foundry 2.0

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CEO Ajit Manocha lays out winning strategy for nation’s comeback at Nikkei Electronics’ World Semiconductor Summit

GLOBALFOUNDRIES CEO Ajit Manocha spoke to a crowd of more than 200 high-ranking executives from the Japanese semiconductor industry last week at the Nikkei Electronics’ World Semiconductor Industry Summit 2013 in Tokyo. During Manocha’s presentation titled, “Reshaping the Foundry Industry: Welcome to Foundry 2.0,” he outlined the evolution and future of the foundry model, the technical and business drivers reshaping the landscape and what it will take for Japanese IDM companies to move forward. Manocha urged Japanese companies to embrace the fabless model and revise their perspective on previous paradigms.

GLOBALFOUNDRIES is committed to the idea that future success in the semiconductor industry is dependent on joint development at the technology definition level, early engagement at the architectural stage and leveraging a more integrated and cooperative ecosystem. The same theme was very present in Manocha’s speech as he emphasized that the idea that Japan’s resurgence into the semiconductor industry can be fueled collaborative device partnerships.

GLOBALFOUNDRIES recently demonstrated its commitment to collaboration at The Common Platform Technology Forum 2013, where we made a number of joint announcements with our partners. Among those collaborations include Rambus, Synopsys, Adapteva and Cyclos Semiconductor – all of which will mutually benefit GLOBALFOUNDRIES and our partners, but more importantly our customers.

You can watch Manocha’s full speech online on our YouTube channel. Important highlights include:

  • The old foundry model will no longer work with due to a slower rate of change, and inflexible methods and systems which are now required to become flexible (23:33)
  • Our vision for 2020 includes homogeneous alliances as well as heterogeneous alliances between foundries, the airline industry, banking industry, semiconductors and the biomedical field (24:53)
  • GLOBALFOUNDRIES’ acceleration of growth, viewed as a timeline (31:36):
    • From 2007 to 2012, we developed the 65-, 45-, 32- and 28nm designs
    • From 2013 to 2017, we have plans to break into the 20-, 14-, 10- and finally the 7nm design

Common Technology, Uncommon Solutions

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common platformBy Mike Noonen

Collaboration has become a well-worn buzzword in our industry in recent years, and for good reason. The scale and complexity of the challenges we collectively face can only be addressed by working together across the entire semiconductor ecosystem. But while many companies are just giving lip service to the concept of collaboration, it has been a part of our DNA at GLOBALFOUNDRIES since our inception.

One of our most important partnerships is in the form of the Common Platform alliance, a groundbreaking collaboration with IBM and Samsung—two of the world’s foremost technology companies—to address the needs of semiconductor manufacturing by providing access to leading-edge CMOS process technologies and extensive enablement support and services. Together we are continuing to redefine the landscape of the semiconductor industry, and the fruits of this partnership will be on display next week at the 2013 Common Platform Technology Forum, which will be held on Tuesday, February 5 at the Santa Clara Convention Center.

The theme of this year’s forum is “Real Collaboration = Big Business.” While we will still be providing a deep look into the underlying technologies offered by the alliance, we also want to demonstrate the impressive business momentum that’s been achieved as a byproduct of this collaboration. 2012 was a particularly strong year, with members of the Common Platform seeing significant growth and taking over both the #2 and #3 spots in the worldwide foundry rankings. Research firm IC Insights recently released its projections for the top 20 leading semiconductor suppliers in 2012, and GLOBALFOUNDRIES jumped six spots to break into the top 20 for the first time. IC Insights projected our 2012 revenue to grow 31% over 2011, which would make us the fastest growing semiconductor company in the world. Similarly, IC Insights’ 2012 foundry rankings saw Samsung make a rapid rise to #3 in the foundry, with a near doubling of foundry revenue for two years in a row.

The forum also will showcase the latest technological advances being delivered to the world’s leading electronics companies. Attendees will see and hear firsthand how the combined expertise of our partners is addressing the most demanding IC design and manufacturing challenges. Our collaborative research and innovative technology development have resulted in an accelerated roadmap and rapid customer adoption, and we’ll touch upon these key highlights:

  • Leading-edge process technologies at 32/28-, 20-, 14-nanometer, and beyond
  • Advanced innovations such as FinFet, design & technology co-optimization, and double patterning
  • A peek into the future of next-generation device innovations being researched: silicon nanowires, carbon nanotubes, and 3D device structures
  • A showcase of our ecosystem partners and Common Platform design, enablement, and implementation offerings in our Partner Pavilion

During the morning session, attendees will have the opportunity to hear keynotes from senior leaders at IBM, Samsung, and GLOBALFOUNDRIES, as well as a special keynote from Dr. Dipesh Patel, Executive Vice President and General Manager of the Physical IP Division at ARM. Dr. Patel will talk about the importance of “partnering for innovation to drive diversity.” Mobile computing is fueling the market demand for diversity, innovation, and expansion of the semiconductor industry, but the challenges being faced by system and SoC designers to meet these requirements in terms of performance, power efficiency, and time-to-market continue to grow in light of advanced manufacturing technologies. Dr. Patel will discuss the importance of a strong ecosystem to deliver the right product on time for commercial success, and why “Real Collaboration” on advanced process technology is a necessary and critical ingredient to address these challenges.

If you aren’t able to attend Tuesday’s event in person, please consider tuning in online via the live webcast, which will also be archived after the event. Details can be found at this link: http://www.commonplatform.com/tf2013

Mike Noonen is Executive Vice President, Worldwide Marketing and Sales, for GLOBALFOUNDRIES. In this role, he is responsible for global customer relationships as well as all marketing, sales, customer engineering and quality functions.

GLOBALFOUNDRIES to Build Leading-Edge R&D Center on Fab 8 Campus

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Aerial view of Fab 8 (rendering)

On January 8th, GLOBALFOUNDRIES announced it will soon begin construction on a new research and development facility at the Fab 8 campus.  Featuring more than a half million square feet of flexible space to support a range of technology development and manufacturing activities, the new Technology Development Center (TDC) will play a key role in the company’s strategy to develop innovative semiconductor solutions allowing customers to compete at the leading edge of technology.

TDC site plan

“As the industry shifts from the PC era to a market focused on mobile devices, we have seen increasingly strong interest from customers in migrating to advanced nodes on an accelerated schedule,” said GLOBALFOUNDRIES CEO Ajit Manocha. “To help facilitate this migration, we are making significant investments in strengthening our technology leadership, including growing our workforce and adding new capabilities to make Fab 8 the hub of our global technology operations.  The new TDC will help us bridge between the lab and the fab by taking research conducted with partners and further developing the technologies to make them ready for volume manufacturing.”

The TDC will house a variety of semiconductor development and manufacturing spaces to support the transition to new technology nodes, as well as the development of innovative capabilities to deliver value to customers beyond the traditional approach of shrinking transistors.

The overarching goal of the TDC is to provide a collaborative space to develop end-to-end solutions covering the full spectrum of silicon technology, from new interconnect and packaging technologies that enable three-dimensional (3D) stacking of chips to leading-edge photomasks for Extreme Ultraviolet (EUV) lithography and everything in between. The TDC will also house important post-production capabilities, including ETest, Bump and Probe, which are increasingly needed at the foundry location for fast yield feedback and to support customer business models.

The Fab 8 campus is an ideal home for the company’s leading-edge technology development activities.  The proximity of the IBM Joint Development Alliance activities in East Fishkill and the College of Nanoscale Science and Engineering (CNSE) at the University of Albany, combined with the growing presence of technology development personnel on the Fab 8 campus, have helped make New York’s “Tech Valley” a global center for next-generation technologies.

Renderings of Fab 8 campus with TDC renderings

“This significant expansion demonstrates that the investments we have made in nanotechnology research across New York State are producing the intended return— the creation of high-paying jobs and generation of economic growth that is essential to rebuilding our state,” said New York Governor Andrew M. Cuomo.  “New York has become the world’s hub for advanced semiconductor research and now, the Technology Development Center will further help ensure the innovations developed in New York, in collaboration with our research institutions, are manufactured in New York.”

Speaking about the announcement, CNSE Senior Vice President and CEO Dr. Alain Kaloyeros said, “The expansion of GLOBALFOUNDRIES’ advanced technology and manufacturing capabilities, supported by new investments and location of new high-tech research and development jobs at the College of Nanoscale Science and engineering, will fuel exciting opportunities for both residents and businesses across New York State, in accordance with Governor Cuomo ‘New York Open for Business’ strategy, and continue to pave the way for long-term economic growth and prosperity catalyzed by computer chip innovations.”

The company plans to begin construction in early 2013 with completion targeted for late 2014.  Since breaking ground on Fab 8 in 2009, GLOBALFOUNDRIES has created approximately 2,000 new direct jobs and that number is expected to grow by another 1,000 employees for a total of about 3,000 new jobs by the end of 2014.   

Quick Facts about the TDC

  • Three-level building with approximately 550,000 gross square feet of varying occupancy types
  • Approximately 90,000 square feet of flexible cleanroom space
  • Approximately 108,000 square feet of clean space to support a range of technology development and manufacturing activities
  • The additional investment in the TDC will increase the total capital investment for the Fab 8 campus to approximately $8.5 billion

For more information on the TDC, check out these resources and articles 

Working Together To Build Tomorrow’s Workforce

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Earlier this week, GLOBALFOUNDRIES launched the Tech Valley Connection for Education and Jobs, an initiative in New York’s Capital Region involving educators, administrators, and businesses interested in developing the workforce of tomorrow.

The Tech Valley Connection for Education and Jobs is a 13-county regional laboratory that will:

  • Collect and build on the most innovative practices and best ideas in education.
  • Leverage the strengths of all stakeholders.
  • Articulate the vision of the future education system.
  • Identify road blocks in achieving that vision.
  • Systematically eliminate those roadblocks.

Initial work began in 2009 when the Obama administration suggested that GLOBALFOUNDRIES design a new workforce development initiative to define a clear path to tomorrow’s education system.  Led by GLOBALFOUNDRIES and facilitated by the Center for Economic Growth (CEG), the initiative is intended to be a pilot to facilitate, coordinate and communicate best practices between K-12 and higher education institutions and businesses in the region. The initiative is designed to be able to scale upward in size in order to help improve the education system nationally.

Mike Russo, director of government relations at GLOBALFOUNDRIES.

“The initiative will collect and build on the most innovative practices and best ideas,” said Mike Russo, director of government relations at GLOBALFOUNDRIES, who is responsible for the corporation’s U.S.-based education initiatives.  “The goal is to articulate the vision of the future education system, identify roadblocks in achieving that vision and systematically eliminate those roadblocks, ultimately helping to improve the system nationally.”

To date, the Tech Valley Connection for Education and Jobs has engaged businesses, government, labor, and education entities; has surveyed over 100 school districts about their existing and desired programs and roadblocks to achieving them; and has a growing roster of business, teacher, and student “ambassadors” serving as communication links to the initiative.  There are 20 regional chambers of commerce, 111 school districts and 345 schools involved in the initiative.   As a significant employer in New York State, this initiative will develop a world-class education pipeline across the region that will enable not only the success of GLOBALFOUNDRIES, but other high tech businesses in the region.