GLOBALFOUNDRIES Announces Agreement with Singapore’s Institute of Microelectronics and Masdar Institute of Science and Technology of Abu Dhabi for Twin Lab

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GLOBALFOUNDRIES signed a MOU with Singapore’s Institute of Microelectronics (IME) and Masdar Institute of Science and Technology of Abu Dhabi on Tuesday, Nov. 26, to set up an Abu Dhabi-Singapore Twin Lab. The Twin Lab will aim to advance electro-mechanical systems (MEMS) technologies for automotive, aerospace, consumer, healthcare, environmental monitoring, industrial and mobility applications.

The announcement was made at the 7th convening of the Abu Dhabi-Singapore Joint Forum (ADJSF) hosted in Singapore at the Marina Bay Sands Expo Convention Centre. The total funding pledged was US $21 million for three years.

The Twin Lab is a unique collaborative effort between research institutions and industry with GLOBALFOUNDRIES as the industrial partner. GLOBALFOUNDRIES will serve as an overall program manager, as well as manufacturing partner for the Twin Lab. The partnership will help GLOBALFOUNDRIES to expand its IP portfolio to address MEMS high-volume manufacturing at effective cost levels and capacity to serve the fast growing MEMS market.

As the academic partner, Abu Dhabi’s Masdar Institute will develop device designs based on market requirements and the Institute of Microelectronics Singapore will serve as the research institute for the execution of design concepts. GLOBALFOUNDRIES will work closely with ATIC and EDB to bring these concepts into realization.

The initial areas of focus for the Twin Lab will include MEMS inertial sensors, energy harvesters, nano-opto-mechanical sensors, and ultrasonic transducers. The collaboration is intended to deliver capabilities that can mitigate power issues in high performance devices, such as automobile, industrial and autonomous wireless sensor nodes. It is also expected to improve sensitivity and accuracy for effective detection in healthcare, aerospace and industry applications.

 “We are pleased to be in a strategic and mutually beneficial collaboration with the renowned research institutes from Singapore and Abu Dhabi,” said Mr. K. C. Ang, Senior Vice President and General Manager of GLOBALFOUNDRIES Singapore. “This joint partnership will enable us to harness their R&D capabilities to create innovative technologies that will further solidify and strengthen our foundation in MEMS manufacturing.” 

GLOBALFOUNDRIES CEO Ajit Manocha at Semiconductor Industry Association’s Annual Dinner

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Last night, the Semiconductor Industry Association hosted its Annual Award Dinner in San Jose and as the 2013 SIA Chairman, our CEO Ajit Manocha was honored to say a few words at the event. As Ajit hands over the reins and we welcome IBM’s John Kelly as the new 2014 SIA Chairman, we thought it only fitting to reflect on the last 12 months and the value the SIA brings to the semiconductor industry.

In just one year, the SIA aided legislation to ensure continued supplies of helium, achieved landmark progress on export controls reform and brokered a deal with the EPA to fix problematic greenhouse gas reporting requirements.

These achievements did not come easy, but that in essence, is where the strength of the SIA really shines through. The organization has proven to be nimble in identifying opportunities and challenges, and then executing on a plan to achieve a positive outcome more effectively than many other industry associations.

The SIA has earned its reputation as a strategic policy partner through its ability to work collaboratively with policymakers and supply technical expertise to support the needed policy changes. In fact, Ajit credited the SIA’s greatest strength as its ability to bring industry leaders together to address challenges and implement strategies to overcome them.

In addition to sharing the successes of the past year, Ajit also presented Mike Splinter, CEO of Applied Materials, with the Robert Noyce Award. The Robert Noyce Award is one of the semiconductor industry’s highest honors, named in honor of industry pioneer Robert Noyce, co-founder of Fairchild Semiconductor and Intel.

The award recognizes exceptional leaders in the semiconductor ecosystem, which is very fitting given Splinter’s contributions and work over his thirty year career. His tremendously successful career at Intel as a fab manager and other positions led to joining Applied Materials as President and CEO in 2003.

Under his leadership, Applied Materials’ CVD and other technology enabled dramatic reductions in manufacturing costs and more. His advocacy for STEM education, through serving on boards of University of Wisconsin Foundation and Santa Clara University, supports local community education initiatives through the Applied Materials Foundation.

We congratulate Mike Splinter on this well-deserved industry recognition.

GLOBALFOUNDRIES CEO Ajit Manocha Participates in President Obama’s Inaugural SelectUSA Summit

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Last Thursday, GLOBALFOUNDRIES CEO, Ajit Manocha, participated in President Obama’s inaugural SelectUSA Summit in Washington D.C. The event was hosted by President Obama, who spoke to 1,200 attendees from companies around the world.

The Summit was designed to connect investors with United States businesses to explore business investment opportunities. Business leaders, global investors, state and local representatives and high-level U.S. Government officials gathered to learn more about the resources available to support business investment in the U.S. The Summit included two days of informative panels and breakout sessions on the U.S. market and industry sectors, and informative sessions with U.S. government officials on a variety of topics.

Manocha spoke on a panel entitled “U.S. Leadership in Advanced Manufacturing,” alongside co-panelists Dan Armbrust, CEO of SEMATECH, Jeannine Sargent, president of Energy Flextronics and William T. Powers III, executive vice president and CFO of Rolls-Royce North America. The panel addressed the topics of factors that contribute to U.S. competitiveness in advanced manufacturing.

During the panel, Manocha described GLOBALFOUNDRIES’ commitment to promoting advanced manufacturing in the United States and the economic factors that contributed to the company’s decision to locate its latest foundry in Saratoga County, New York. Manocha stated one of the keys to GLOBALFOUNDRIES’ decision to locate in New York was the collaborative environment and relationships with the state of New York, industry partners and educational institutions. GLOBALFOUNDRIES believes these collaborations are the heart of the ecosystem that supports research and development of the workforce important to the semiconductor industry. New York has provided the necessary vision and leadership to develop a strategic focus on key industry sectors, like nanotechnology.

GLOBALFOUNDRIES CEO Ajit Manocha Named to President Obama’s Advanced Manufacturing Partnership Steering Committee 2.0

Last week, President Obama announced the Advanced Manufacturing Partnership Steering Committee ‘2.0,’ part of a continuing effort to maintain U.S. leadership in the emerging technologies that will create high-quality manufacturing jobs and enhance America’s global competitiveness.

GLOBALFOUNDRIES CEO Ajit Manocha is excited to serve on the new Steering Committee comprised of leaders in industry, academia, and labor, committed to building on progress made by the President’s inaugural Advanced Manufacturing Partnership Steering Committee.

The Advanced Manufacturing Partnership Steering Committee 2.0 will function as a working group of the President’s Council of Advisors on Science and Technology (PCAST). In addition, it will work closely with the White House’s National Economic Council and Office of Science and Technology Policy and the Department of Commerce, to fully implement the initial Steering Committee’s previous recommendations, scale promising manufacturing workforce innovations and partnerships, and identify new, concrete strategies for securing the Nation’s competitive advantage in transformative early-stage technologies.

In addition, the Advanced Manufacturing Steering Committee 2.0 will engage the broader manufacturing community through regional working sessions and forums designed to surface examples of innovative strategies to build US manufacturing competitiveness.

GLOBALFOUNDRIES is deeply committed to the development of manufacturing and technology innovation in the U.S. At our Fab 8 campus in New York State, CEO Ajit Manocha has shared his vision for GLOBALFOUNDRIES and a greater vision for how the U.S. can shape the local, regional and global economy.  Our investment in New York began in 2009 with the construction of Fab 8 and has continued with the addition of approximately two million square feet of development and the creation of more than 2,000 new direct jobs, as well as thousands of in-direct new jobs in the economy.

Manocha has called for innovative approaches to public-private partnerships that will support new advanced manufacturing operations and has pressed that those operations must be part of the nation’s economic strategy. Through the Advanced Manufacturing Partnership Steering Committee 2.0, he will continue to promote the importance of manufacturing in the U.S. and advance our global competitiveness in industry.

CEO Ajit Manocha is excited to be expanding our support for the Advanced Manufacturing Partnership and to be serving on its second-generation Steering Committee along with leaders from across manufacturers of all sizes, leading universities, and labor. Chaired by Andrew Liveris, President, Chairman, and CEO of the Dow Chemical Company, and Rafael Reif, President of the Massachusetts Institute of Technology, the new Steering Committee includes:

  • Wes Bush, Chairman, CEO and President, Northrop Grumman Corp.
  • Mary Sue Coleman President, The University of Michigan
  • David Cote, Chairman and CEO, Honeywell
  • Nicholas Dirks, Chancellor, University of California, Berkeley
  • Kenneth Ender, President, Harper College
  • Leo Gerard, International President, United Steelworkers
  • Hon. Shirley Ann Jackson, President, Rensselaer Polytechnic Institute
  • Eric Kelly, President and CEO, Overland Storage
  • Klaus Kleinfeld, Chairman and CEO, Alcoa Inc.
  • Andrew Liveris, President, Chairman, and CEO, The Dow Chemical Company
  • Ajit Manocha, CEO, GLOBALFOUNDRIES
  • Douglas Oberhelman, Chairman and CEO, Caterpillar Inc.
  • Annette Parker, President, South Central College
  • G.P. “Bud” Peterson, President, Georgia Tech
  • Luis Proenza, President, The University of Akron
  • Rafael Reif, President, Massachusetts Institute of Technology
  • Eric Spiegel, President and CEO, Siemens Corp.
  • Mike Splinter, Executive Chairman of the Board, Applied Materials Inc.
  • Christie Wong Barrett, CEO, Mac Arthur Corp.

For more information about the Advanced Manufacturing Partnership, please visit: http://www.manufacturing.gov/amp.html

For more information about PCAST, please visit: http://www.whitehouse.gov/administration/eop/ostp/pcast

Foundry 2.0: New White Paper and Video Interview with CEO Ajit Manocha

Today our friends over at VLSI Research released two thought-provoking commentaries on the evolution of the foundry industry.

The first is a video featuring GLOBALFOUNDRIES CEO Ajit Manocha being interviewed by G. Dan Hutcheson, VLSI’s chairman and CEO. In the video, which can be viewed on the weSRCH.com web site, these two industry veterans discuss the challenges facing the semiconductor industry and why a new foundry model is needed to enable continued innovation.

Today VLSI also released a new white paper by Hutcheson that delves into the historical development of the semiconductor foundry business model, how things went wrong in the 2000s, and why a new model of foundry partnership is needed—precisely the “Foundry 2.0” model that Manocha has called for since taking the helm at GLOBALFOUNDRIES. The white paper can be downloaded here (registration required).

After discussing the inception of the industry in the 1980s, Hutcheson reviews some of the key infrastructural shifts in the early 1990s that led to the rapid growth of the foundry segment—the most important of which was the rising cost of leading-edge semiconductor fabs. “The foundry movement hit high gear in the early nineties, when the cost of a fab was just passing the one-billion dollar mark,” Hutcheson writes. “The cost of a fab was roughly rising at about half the rate of Moore’s Law, or a doubling every two nodes. Moreover, it was not just the cost of building a new fab, because existing ones had to be upgraded every node for a chip maker to stay in the game. The incremental cost of keeping a fab up-to-date was a growing capital burden, which became another big barrier to entry.”

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But just as the foundry industry was beginning to hit its stride, the fast-moving semiconductor marketplace continued to evolve. “By 2000, the foundry business model had moved from an idea for companies who could not afford fabs to being front and center in the mainstream of manufacturing,” Hutcheson writes. “Many had come to believe the foundry was the future of manufacturing. But the nature of the business was changing as storm clouds formed on the horizon. These storm clouds grew darker as conflicting market and technology pressures were forcing change.” Hutcheson reviews these market and technology pressures, which include rising competition, increasing emphasis on cost, and the daunting challenges presented by new wafer sizes, transistors, and materials. All of these factors led to an erosion of trust between foundries and their customers and opened the door for some to speculate that the foundry model might be dead.

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To solve these problems, Hutcheson calls for a new working relationship that melds the seamless collaboration of an IDM with the flexibility of the fabless-foundry model. This “collaborative device manufacturing” approach must be structured to collaborate seamlessly, allowing the fabless company to innovate on the foundry’s platform as an extension of its own strategy starting early in a new process node’s development. “GLOBALFOUNDRIES, to a great extent, was perfectly positioned to address the emerging need for a new foundry model,” Hutcheson writes. “Its roots were as an IDM, having spun out from AMD in 2009. Having acquired Chartered, it also gained deep roots in the foundry 1.0 model, allowing it to bridge both worlds. Its CEO, Ajit Manocha, deeply understood the issues. . . . So it was no surprise that Manocha would be the first foundry CEO to address the issue, spelling out a new model he called Foundry 2.0.”

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Readers of this blog will be no stranger to the Foundry 2.0 concept, but Hutcheson brings a fresh interpretation as he describes the intricacies of the new business model and puts Foundry 2.0 in its proper historical context.

GLOBALFOUNDRIES Experts to Present at SEMICON West 2013

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The countdown is on for SEMICON West 2013! GLOBALFOUNDRIES is gearing up for a number of exciting events which will take place at the exhibition next week. The event, which runs from July 9-11 in San Francisco, will highlight key advances in manufacturing technologies, device architectures, lithography, MEMS, packaging and materials technology, in addition to other semiconductor research and development.

GLOBALFOUNDRIES CEO Ajit Manocha will deliver the opening keynote address on Foundry-Driven Innovation in the Mobility Era, which will cover new challenges, players and technology caused by the increasing demand for mobile devices. His presentation will take place on July 9 at 9 a.m. at the Keynote Stage in Esplanade Hall. After his keynote, Ajit will be officially awarded the “SEMI Outstanding EHS Achievement Award – Inspired by Akira Inoue,” for his contributions in the areas of environment, health and safety. To read more about the honor, check out our recent blog post that details Ajit’s leadership in the field and contributions to GLOBALFOUNDRIES’ environment and safety.

In addition to these presentations by Ajit, a number of GLOBALFOUNDRIES experts will present TechXPOTs including;

Tuesday, July 9:

Wednesday, July 10:

All GLOBALFOUNDRIES TechXPOTS will take place at the South Hall of the Moscone Center. We encourage all who are interested in these topics to register and attend to learn more about GLOBALFOUNDRIES’ development, innovation and role in the industry.

In addition to our TechXPOT presentations, GLOBALFOUNDRIES will sponsor the MIG Member Cocktail Party on July 10 at Restaurant LuLu. This event will be a great opportunity for members of the MEMS community to network, catch up with colleagues and become further immersed in SEMICON West.

We look forward to meeting and interacting with all members of the semiconductor community at the show. To register for this event, check out the SEMICON website and be sure to follow GLOBALFOUNDRIES participation on Twitter via #SEMICONWest!

GLOBALFOUNDRIES CEO Honored for Environment, Health and Safety (EHS) Leadership

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This morning, SEMI announced that GLOBALFOUNDRIES CEO Ajit Manocha received this year’s “SEMI Outstanding EHS Achievement Award – Inspired by Akira Inoue.” Named after the late Akira Inoue who served as president of Tokyo Electron Limited, the award recognizes individuals in industry and academia who have made significant contributions in the area of environment, health and safety (EHS) by exercising leadership or demonstrating innovation in the development of processes, products or materials that reduce EHS impacts during semiconductor manufacturing.

Within GLOBALFOUNDRIES, Manocha leads the company’s Executive Stewards Council (ESC), the leadership forum for strategic direction and accountability of risk management and corporate responsibility issues affecting GLOBALFOUNDRIES. Manocha’s leadership within GLOBALFOUNDRIES has resulted in significant EHS achievements for the organization, including the following;

  • Driving a vision consisting of a zero-incident workplace. The company achieved 2012 employee total incidence case and lost-day case rates well below US industry benchmarking. Manocha ensured that there was a strong emphasis on safety metrics in executive projects at Fab 8 in Malta, New York and GLOBALFOUNDRIES’ Singapore Fabs all received “Silver Awards” for Health and Safety.
  • Setting global goals to reduce greenhouse gas (GHG) emissions and water and energy consumption by significant percentages by 2015.
  • Utilizing reclaimed NEWater at GLOBALFOUNDRIES Singapore for incoming supply and continuing to pursue multiple energy-efficiency and water reduction projects. Energy efficiency projects in 2012 achieved reductions of 50 GWh, with a 2013 goal of a further 57 GWh reduction.
  • Meeting customer requests for “Tantalum Conflict-free” products in 2012.
  • Transforming Fab 1 in Dresden from a dedicated IDM fab to high-volume foundry operation, powered by two energy-efficient tri-generation power plants.

Manocha’s leadership also extends further beyond GLOBALFOUNDRIES into the entire electronics ecosystem;

  • Under his leadership as Vice Chairman of the Semiconductor Industry Association (SIA) Board of Directors in 2011, he played a vital role in pushing forward EHS initiatives ranging from climate protection to chemical management and occupational health and safety.
  • For the last two years, Manocha has been the SIA Executive champion for EHS matters at the World Semiconductor Council.
    • At the 2012 annual CEO meeting of the WSC, Manocha shepherd the discussion of EHS topics and persuaded his fellow CEO’s to take action to protect the environment, conserve resources, and achieve the PFC reduction goal. For its part, GLOBALFOUNDRIES’ newest US fab, Fab 8 meets the WSC Best Practice commitment for PFC reduction. Fab 1 has incorporated best practices for PFC reduction since 1999.
    • At the 2013 WSC meeting Manocha championed a “Conflict-free Supply Chain” policy to address concerns related to sourcing material tantalum, tungsten, tin and gold from “conflict regions” of the Democratic Republic of Congo and adjoining countries. The WSC subsequently adopted such a policy. For its part, GLOBALFOUNDRIES has already met customer requests for “Tantalum Conflict-free” products in 2012.

The Award will be presented to Manocha in person on July 9th during his SEMICON West Opening Keynote on the future of semiconductor technology. As a company this is a huge honor and we look forward to progressing out EHS goals even further this year and beyond.

GLOBALFOUNDRIES in New York: Development, Culture and Community

A Special Report From The Saratogian

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This week, The Saratogian, a leading newspaper that covers news from Saratoga Spring and the surrounding communities, published a special insert on GLOBALFOUNDRIES. Totaling 32 pages, the insert consists of four, eight-page sections which explore the history of GLOBALFOUNDRIES and Fab 8, the development of Tech Valley in New York and our contributions to the region. This insert follows a previous special 56-page report by the Albany Business Journal, published in September.

The insert gives you and inside look at our Luther Forest Technology campus in Saratoga County, where about 2,000 people work in the 300,000-square-foot cleanroom and 385,000 square-feet of office space and outside area. Highlights in the special insert include:

  • The story of the evolution and founding of GLOBALFOUNDRIES in Malta in the 1990’s
  • Nano Profiles on employees including Eric Choh, Olivier Vatel, Sandeep Dave, Jim Fedorchak, Emily S. Reilly, Wendy Nicoson, Nakesha Smith, Janet L. Paluh, Deborah Onslow, Alain Kaloyeros and many more!
  • Explanations of the science behind what we do, including keeping products clean, chemical changes and details of working on a nanoscale
  • Why Malta? A description of some of the many reasons why GLOBALFOUNDRIES settled on Malta as the foundation for Fab 8
  • Background on The College of Nanoscale Science and Engineering (CNSE) and the G450 Consortium
  • The importance of technology and nanotechnology in the classroom, including how GLOBALFOUNDRIES has partnered with the community, local school districts and nonprofits to promote education

GLOBALFOUNDRIES is proud to be a leader in the global semiconductor community, but we are also greatly invested in the education and development of technology and business in the Capital Region of New York. Read more about that in the special insert, which is available online.

The Mobile Revolution: Taking it to the Next Level

By Srinivas Nori

Today our friends at ARM announced the launch of their newest processor targeted at the rapidly growing market for mid-range mobile devices. The ARM Cortex-A12 processor is expected to offer a significant performance uplift and direct upgrade path from the highly successful Cortex-A9 processor, while matching the energy-efficiency of its predecessor.

Most of the attention these days goes to the latest and greatest high-end superphones and tablets—and of course ARM has processors to serve this important segment—but the market for entry-level and mid-range smartphones is where the real growth is expected to occur in the coming years. For example, a recent report by ABI research projected that shipments of sub-$250 smartphones will grow from 259 million units in 2013 to 788 million units in 2018, at which point they will make up nearly half (46%) of the global smartphone market.

What do consumers want in an entry-level smartphone? They expect similar levels of performance and battery life as enabled by application processors for high-end smartphones, but in a more cost-effective system. Delivering this functionality is no small challenge, and it requires a tight partnership between SoC design and process technology to optimize performance, power, and cost.

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Timeline of GLOBALFOUNDRIES and ARM’s relationship

We have been collaborating for years to optimize ARM processors for GLOBALFOUNDRIES leading-edge process technology. Today, in conjunction with the launch of the Cortex-A12 processor, we announced new power, performance and cost optimized POP™ IP technology offerings for the ARM Cortex-A12 and ARM Cortex-A7 processors for our 28nm-SLP High-K Metal Gate (HKMG) process technology. You can read more here about this latest milestone in our multi-year collaboration with ARM. The upshot is that this combination of ARM’s processor IP and our leading-edge process technology will enable a new level of system performance and power efficiency with the optimum economics necessary to serve the market for mid-range mobile devices. GLOBALFOUNDRIES’ 28nm-SLP process technology and associated ARM POP IP for the Cortex-A12 processor enables up to 70 percent higher performance (measured single-thread performance) and up to 2x better power efficiency in comparison to a Cortex-A9 processor using 40nm process technology. Designers can achieve even higher performance by trading off for lower power efficiency, depending on their application needs.

But of course the technology industry continues its relentless march forward, and we have no plans to stop there. We are already collaborating to optimize ARM processor IP for our next-generation 14nm-XM technology. Our 14 nm-XM offering is based on a modular technology architecture that uses a 14nm FinFET device combined with elements of GLOBALFOUNDRIES’ proven 20 nm-LPM process, which will give SoC designers the benefits of FinFET technology with reduced risk and time-to-market. The XM stands for “eXtreme Mobility,” and it is truly optimized for mobile SoC designs.

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14XM Dual-Core Cortex-A9 PPA Proof Point. Similar results are expected for Cortex-A12

Back in February at the Common Platform Technology Forum, we announced results from the industry’s first implementation of a dual-core ARM® Cortex™-A9 processor using FinFET transistors. We found the following results for a Cortex-A9 processor implemented on 14nm-XM technology. Similar results are expected for Cortex-A12 processor implementations.

Here are the technical details:

  • High-performance, energy-efficient ARM processors implemented on 28nm-SLP typically use 12-track libraries. However at 14nm-XM FinFET technology, much higher performance and more energy-efficient ARM processors can be implemented using 9-track libraries resulting in further die-size reductions.
  • At constant power, the frequency achieved with 14nm-XM technology based implementation (using 9-track libraries) is expected to be 61% faster than the frequency achieved with 28nm-SLP technology based implementation (using 12-track libraries).
  • At constant frequency, the power consumed by 14nm-XM technology based implementation is expected to be 62% lower than the power consumed by 28nm-SLP technology based implementation.
  • The performance-power efficiency of 14nm-XM technology based implementation (expressed as DMIPs/milliwatts) is anticipated to be more than twice that of the 28nm-SLP technology based implementation, while using half the silicon area.

The mobile revolution has only just begun. We are excited to see where this dynamic industry will go next, and you can be sure we will continue collaborating with innovative partners like ARM to bring the next generation of connected devices to life.

Srinivas Nori is director, SoC innovation at GLOBALFOUNDRIES. In this role Srinivas owns the GLOBALFOUNDRIES strategy and realization for ARM ecosystem based solutions. Srinivas also oversees the exploration, identification, evaluation and collaborative offering of innovative SoC solutions.

GLOBALFOUNDRIES to Highlight Technology Innovation at DAC 2013

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GLOBALFOUNDRIES is ramping up for the Design Automation Conference (DAC) this summer! During the event, which runs from June 3-6 in Austin, Texas, GLOBALFOUNDRIES will be featuring the latest details on its mainstream and leading-edge technology solutions and roadmap.  

GLOBALFOUNDRIES will be located at booth #1314 at DAC 13 for the duration of the event. In addition to highlighting our new 14nm-XM FinFET technology that will deliver more than twice the energy efficiency of a 28nm-SLP technology-based design, we’ll be demonstrating several products, including:

  • 20nm/14XM solutions; 28nm design methodology (Analog and Digital)
  • 28nm Super Low Power (SLP) Technology with Gate First HKMG, the optimized solution for high performance mobile applications, fully enabled today with design kits and IP
  • GlobalShuttle, the Multi Project Wafer program for product prototyping, device characterization, IP validation and design enablement
  • RF CMOS and other value added solution process modules
  • DFM; analog and digital reference flows; process-specific applications

GLOBALFOUNDRIES will also host a series of one-hour private technical seminars daily, which  will touch on a variety of topics, from our collaborative work with ARM to produce smartphones on our 28nm-SLP HKMG process to parasitic challenges for FinFET designs and analog mixed signal flows and methodology for double patterning and FinFETs. Pre-registration will be required for these informative seminars.

In addition to the seminars, a number of presentations and theater presentations will be given throughout the week including:

Tuesday, June 4

  • Pavilion Panel, Dave McCann: Is This the Right Time to Create Standards for 2.5D/3D-IC Designs?
  • Synopsys Breakfast, Subi Kengeri and Kelvin Low: Ready for Deploying 14XM FinFETs in Your Next Mobile SoC Design Management Day, Bob Madge: Decision-Making for Complex ICs
  • Cadence IP Talks, Subi Kengeri: Enabling SoC level differentiation through advanced technology R&D

Wednesday, June 5

  • Mentor Panel, Richard Trihy, No Fear of FinFET
  • Pavilion Panel, Luigi Capodieci, Learn the Secrets of Design for Yield

For more information and to schedule meetings at the show, check out our DAC microsite.